Thomas E. Dinan, Ph. D.

Owner and President

Dinan photoElectrolytics, Inc.
389 Via Primavera Drive
San Jose, CA 95111

Tel. 408-307-1125
thomas.dinan@electrolytics.org

Dr. Dinan has devoted his professional career to electroplating thin-films onto wafers and ceramic substrates for fabricating solar, electronic, and magnetic devices. In July 2002 he founded Electrolytics, Inc. to assist companies to set up and use electroplating processes for depositing interconnects or other structures on semiconductor or ceramic wafers. Listed below is a description of his professional career, education and publications.

Work History

10/10 - 8/12. Twin Creeks Technologies, Inc. (now owned by GT Advanced Technologies), San Jose, CA. Sr. Member of Technical Staff.

Responsibilities:

10/08 - 10/10. Touchdown Technologies, Inc. (now owned by Advantest), Baldwin Park, CA. Member of Technical Staff.

Responsibilities:

7/03 - 4/08. NanoNexus, Inc., San Jose, CA. Member of Technical Staff.

Responsibilities:

6/03 - present. Electrolytics, Inc., San Jose, CA. President.

Responsibilities:

5/01 - 6/03. Read-Rite, Inc., Fremont, CA. Electroplating and Chemical Etch Development Manager

Responsibilities:

5/97 - 4/01. IBM, Almaden Research Center, San Jose,CA. Electroplating Engineer, Thin Film Head Development. Responsibilities:

8/95 - 4/97. IBM, East Fishkill, NY. Electroetch Engineer. Solder Bump Plating Department. Responsibilities:

1/95-7/95. IBM, East Fishkill, NY. Process Integration Engineer. Copper Interconnect Development. Responsibilities:

5/93-12/94. IBM, East Fishkill, NY. Electrolytic Processes Engineer. Solder Bump Plating Development Department. Responsibilities:

1/92-4/93. IBM, East Fishkill, NY. Electroplating Engineer. Advanced Plating Technology Department. Responsibilities:

11/91 to 12/91. ECI Technology, East Rutherford, NJ. Consultant. Responsibilities:

7/89 to 8/91. Swiss Federal Institute of Technology, Lausanne, Switzerland. Postdoctoral Research Scientist. Research topics:

8/84 to 6/89. Columbia University, New York, NY. Graduate Research Assistant.

11/81 to 7/84. Reynolds Metals Company, Reduction Research Laboratory, Sheffield, AL. Research Scientist. Responsibilities:

Education:

Society Memberships:

  1. The American Electroplaters and Surface Finishers Society
  2. The Electrochemical Society
  3. The International Society of Electrochemistry
  4. IEEE Magnetics Society

Patents:

  1. Magnetic head for a hard disk drive having varied composition nickel-iron alloy magnetic poles.  U.S. Patent No. 6,724,571.
  2. Simultaneous definition and direct transfer of a write head pole and coil for a magnetic read/write head.  U.S. Patent No. 6,696,226.
  3. System and method for a sacrificial anode in a kerf for corrosion protection during slider fabrication.  U.S. Patent No. 6,667,457.
  4. Method of manufacturing high aspect ratio photolithographic features.  U.S. Patent No. 6,664,026.
  5. Self-aligned void filling for mushroomed plating.  U.S. Patent No. 6,631,546.
  6. Method of electroplating a nickel-iron alloy film with a graduated composition.  U.S. Patent No. 6,599,411.
  7. Dual coil and lead connections fabricated by image transfer and selective etch.  U.S. Patent No. 6,507,456.
  8. Rolling Ball Connector. U.S. Patent No. 6,358,627. Mar. 19, 2002
  9. Methods of monitoring components in the TiW etching bath used in the fabrication of C4s. U.S. Patent No. 6,238,589. May 29, 2001.
  10. Rolling Ball Connector. U.S. Patent No. 6,180,317. Jan. 30, 2001
  11. Use of argon sputtering to modify surface properties by thin film deposition. U.S. Patent No. 6,068,923. May 30, 2000
  12. In-situ contact resistance measurement for electroprocessing. U.S. Patent No. 6,037,790. March 14, 2000.
  13. Use of argon sputtering to modify surface properties by thin film deposition. U.S. Patent No. 5,956,573. Sept. 21, 1999.
  14. Electrochemical etching apparatus and method for spirally etching a workpiece. U.S. Patent No. 5,865,984. Feb. 2, 1999.
  15. Selective chemical etching in microelectronics fabrication. U.S. Patent No. 5,800,726. Sept. 1, 1998
  16. Vertical electroetch tool nozzle and method. U.S. Patent No. 5,536,388. July 16, 1996.

Publications:

  1. Thomas E. Dinan, "Metrology Errors in the Use of Insulating Dots for Plated Thickness Measurements,"Plating & Surface Finishing 90(10), 50 (2003).
  2. T.E. Dinan, M. Matlosz and D. Landolt, "Experimental Investigation of the Current Distribution on a Recessed Disk Electrode," J. Electrochem. Soc. 138(10), 2947(1991).
  3. T.E. Dinan and H.Y. Cheh, "The Effect of Arsenic upon the Hardness of Electrodeposited Gold," J. Electrochem. Soc. 139(2), 410(1992).
  4. T.E. Dinan, M. Matlosz and D. Landolt, "A Recessed Rotating Disk Electrode Design for
    Pulse Plating," Extended Abstracts of the Electrochemical Society, Fall Meeting, October
    14-19, 1990, p. 529, Abstract No. 366.
  5. T.E. Dinan and H.Y. Cheh, "The Plating of Gold/Arsenic Alloys," Extended Abstracts of
    the Electrochemical Society, Fall Meeting, October 14-19, 1990, p. 526, Abstract No. 363.
  6. T.E. Dinan, D. Landold, P. Ruterana, P. Buffat, "Rapid Preparation of Cross-sectional TEM Samples from Electroplated Copper," in Workshop on Specimen Preparation for Transmission Electron Microscopy of Materials II, R. Anderson editor, Vol. 199, p. 281, Materials Research Society, Pittsburgh, PA (1990).
  7. A. Borgerding, E. Brost, W. Schmickler, T. Dinan and U. Stimming, "Kinetic Investigation of the Fe2+/Fe3+ Reaction in Frozen and Liquid HClO4*5.5 H2O," Ber. Bunsenges. Phys. Chem. 94, 607 (1990).
  8. T.E. Dinan, W.-F. Jou, H.Y. Cheh, "Arsenic Deposition onto a Gold Substrate," J. Electrochem. Soc. 136(11), 3284(1989).
  9. Thomas Dinan and Ulrich Stimming, "Temperature and Frequency Dependence of the Double Layer Capacity on Gold in HClO4*5.5 H2O," J. Electrochem. Soc. 133(12), 2662(1986).

Presentations:

  1. "Synergistic Effects of Copper Plating Additives & Filter Types for Coil Plating in Write Heads" by Thomas E. Dinan, Saad Doss, Satinder Singh and Leonora Balbuena. Presented at AESF Sur/Fin 2003, June 24, 2003, Milwaukee, WI. AESF Sur/Fin 2003 Proceedings, pp. 202-211.
  2. "Overview of Disk Drive Technology" by T.E. Dinan. Presented at the Santa Clara Chapter of the American Electroplaters and Surface Finishers Society on February 13, 2001.
  3. "Composition and Plating Rate Variations in Narrow Pole Tips for Write Heads" by T.E. Dinan, J. Katine and P. Rice. Presented by T.E. Dinan on October 26, 2000 at the 198th Meeting of the Electrochemical Society, Phoenix, Arizona.
  4. "The Plating of Gold/Arsenic Alloys" by T.E. Dinan and H.Y. Cheh. Presented by T.E.
    Dinan on October 18, 1990 at the 178th Meeting of the Electrochemical Society, Seattle,
    Washington.
  5. "A Recessed Rotating Disk Design for Pulse Plating" by T.E. Dinan, M. Matlosz and D.
    Landolt. Presented by T.E. Dinan on October 18, 1990 at the 178th Meeting of the
    Electrochemical Society, Seattle, Washington.

Poster Sessions:

  1. "The Effect of Halide Additions on the Structure of Pulse Plated Copper," by T.E. Dinan
    and D. Landolt on August 26, 1991 at the 42nd meeting of the International Society of
    Electrochemistry, Montreux, Switzerland.

Personal Information:

Citizenship: USA
Marital Status: Married

 

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